GaN&SiC
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IGBT
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On December 23, 2017, ELEXCON 2017 Shenzhen International Electronics Exhibition came to a successful conclusion. During the three-day exhibition, nearly 350 domestic and foreign exhibitors, including Prismei (Semiconductor Electronics), SII, muRata, Kyocera, TDK, ST, etc., gathered together to comprehensively showcase high-tech products and innovative solutions in the electronics industry.
The exhibition was very popular and the atmosphere was high, attracting numerous professional visitors, which was overwhelming.
This is a feast for the industry, and even more so, a journey of harvest. At this exhibition, Prisemi (Core Electronics) showcased new products such as fast charging ICs, OVP protection ICs, AMOLED driver ICs, as well as new solutions for wireless applications, Bluetooth sound systems, smart homes, etc., attracting many visitors to stop and exchange ideas and negotiate.
The exhibition hall and booth activities alternate, presenting a variety of exciting events. At the same time, exquisite gifts were prepared for the participating audience, instantly igniting the clean and atmospheric atmosphere of the booth.
Attracting multiple news media outlets including International E-commerce, Taiwan Digitimes, Mobile News, and Big Bite to compete for interviews at the Prismei (Xindao Electronics) booth.
Every exhibition is a new beginning, and Prisemi (Xindao Electronics) is willing to hold the hand of cooperation with its peers, continue to work hard, and create a new legend.